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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS59152921
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition giving a cured product having excellent flexibility, alkali resistance, water resistance and mar resistance, and useful for impregnation, casting, lamination and coating use, by compounding an epoxy resin, a diester dicarboxylic acid and a polycarboxylic acid anhydride.

CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin (e.g. polyglycidyl ether of polyphenol, etc.), (B) a diester dicarboxylic acid of formula [R1 and R3 are bivalent aromatic group or (cyclo)aliphatic group; R2 is H or methyl] and (C) a polycarboxylc acid anhydride (e.g. phthalic anhydride). The amounts of the components (B) and (C) are selected to be 0.15W 0.5 equivalent and 0.5W0.85 equivalent per 1 equivalent of the component (A), respectively. The component (B) is preferably prepared by reacting e.g. methyl hexahydrophthalic anhydride, etc. with triethylene glycol, etc. at a molar ratio of 2:1.


Inventors:
NAKAHARA TAKESHI
OOYANAI KATSUO
Application Number:
JP2660183A
Publication Date:
August 31, 1984
Filing Date:
February 18, 1983
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/00; C08G59/42; (IPC1-7): C08G59/42
Attorney, Agent or Firm:
Kunihiko Wakabayashi