Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN AND ITS CURED PRODUCT
Document Type and Number:
Japanese Patent JPH0892353
Kind Code:
A
Abstract:

PURPOSE: To provide an epoxy resin composition capable of giving a cured product having small cure shrinkage, excellent thermal shock resistance and especially high mechanical strength such as tensile strength and flexural strength.

CONSTITUTION: This epoxy resin composition contains (A) a low-viscosity epoxy resin containing a trifunctional or tetrafunctional liquid epoxy resin and having a viscosity of ≤100 poise at 25°C, (B) a liquid alicyclic amine mixture (hardener) produced by adding at least one kind of amine selected from menthenediamine and (4-amino-3-methylcyclohexyl)methane to isophorone diamine and containing 10-90wt.% of isophorone diamine in the mixture, (C) an imidazole compound and (D) metal powder having an average particle diameter of ≤100μm. The amount of the component C is ≥0.1 pts.wt. based on 100 pts.wt. of the component A and that of the component D is ≥200 pts.wt. based on 100 pts.wt. of the sum of the components A, B and C.


Inventors:
SUGIMOTO TOSHIO
KAWAGUCHI SADAHIKO
EZAKI SATOSHI
Application Number:
JP25274694A
Publication Date:
April 09, 1996
Filing Date:
September 22, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08K3/08; C08G59/20; C08G59/32; C08G59/56; C08L63/00; (IPC1-7): C08G59/32; C08G59/56; C08K3/08; C08L63/00
Attorney, Agent or Firm:
Nakaya Moriya