Title:
EPOXY RESIN MATERIAL AND MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP2014208764
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin material capable of obtaining a cured product having a low dielectric loss tangent and further effectively removing smear by desmear treatment.SOLUTION: There is provided an epoxy resin material which comprises: two types or more of epoxy resins; an active ester compound; a curing accelerator; and an inorganic filler. The ratio between the epoxy equivalent of the two types or more of epoxy resins and the active ester group equivalent of the active ester compound is 1:0.8 to 1:1.2. The standard deviation σ of the epoxy equivalent determined by the expression (1) of the two types or more of epoxy resins is one third or more of the average epoxy equivalent determined by the expression (2) of the two types or more of epoxy resins.
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| JPH0539409 | EPOXY RESIN COMPOSITION |
| JPS62296449 | SEMICONDUCTOR DEVICE |
Inventors:
KUNIKAWA TOMOTERU
HAYASHI TATSUJI
HAYASHI TATSUJI
Application Number:
JP2014011397A
Publication Date:
November 06, 2014
Filing Date:
January 24, 2014
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L63/00; H01L23/12; H05K1/03
Domestic Patent References:
| JP2012251133A | 2012-12-20 | |||
| JP2013010932A | 2013-01-17 | |||
| JP2013010899A | 2013-01-17 | |||
| JP2014012763A | 2014-01-23 | |||
| JP2014156514A | 2014-08-28 |
Foreign References:
| WO2012165012A1 | 2012-12-06 |
Attorney, Agent or Firm:
Patent business corporation Miyazaki and table-of-contents patent firm