To obtain the subject epoxy resin molding material, excellent in preservation stability and having high adhesion by including an epoxy resin having plural epoxy groups in one molecule, a compound having plural phenolic hydroxyl groups in one molecule, a curing accelerator and a specific amount of an inorganic filler therein.
This epoxy resin molding material is obtained by including an epoxy resin having two or more epoxy groups in one molecule [which preferably contains ≥60 wt.% alkyl-substituted bisphenol type diepoxy resin such as 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl based on the total amount of the epoxy resin], a compound having two or more phenolic hydroxyl groups in one molecule (e.g. a phenol resin), a curing accelerator represented by the formula [P-R14]+.X- (P is phosphorus; R1 is a monovalent organic group; X is a compound having two or more phenolic hydroxyl groups) and an inorganic filler (e.g. fused silica or alumina) in an amount of ≥55 vol.%, preferably ≥60 vol.%.
Furusawa, Fumio
Ikezawa, Ryoichi
Koujima, Hirooki
