EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE

Title:

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE

Document Type and Number:

Japanese Patent JP2004175842

Kind Code:

A

Abstract:

To provide an epoxy resin molding material for sealing having good adhesion, excellent mold releasability and moldability and improved package staining and to provide an electronic part device having an element sealed therewith.

The epoxy resin molding material for sealing consists essentially of (A) an epoxy resin, (B) a curing agent, (C) an oxidation type polymer or a copolymer of at least either one of ethylene and propylene having 125-150°C dropping point and ≥5 mg KOH/g acid value, as necessary, containing (D) a compound prepared by esterifying a copolymer of a 5-30C α-olefin and maleic anhydride with a 5-25C monohydric alcohol, (E) an inorganic filler and (F) a flame retardant. The (C) preferably has 15-50 mg KOH/g acid value and 0.3-1.5 penetration. The electronic part device is equipped with the element sealed with the molding material.

Inventors:

WATANABE HISANORI
HAGIWARA SHINSUKE
YAMAMORI MASAMI
FURUSAWA FUMIO
MIYABAYASHI KAZUHIKO
TAMATE HIRONORI

Application Number:

JP2002340665A

Publication Date:

June 24, 2004

Filing Date:

November 25, 2002

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08K3/00; C08G59/40; C08L23/18; C08L23/26; C08L35/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; C08K3/00; C08L23/18; C08L23/26; C08L35/00; C08L63/00; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Hidekazu Miyoshi
Yasuo Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu

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