Title:
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2018168379
Kind Code:
A
Abstract:
To provide an epoxy resin molding material for sealing which can form a cured product excellent in heat resistance because of having high glass transition temperature (Tg) and thermal decomposition temperature, is excellent in adhesion with Ni plating, and causes less peeling and cracking after left at high temperature, and an electronic component manufactured using the resin molding material.SOLUTION: An epoxy resin molding material for sealing contains (A) an epoxy resin, (B) a phenol curing agent, (C) a maleimide resin having a specific structure, (D) a silane coupling agent and (E) an inorganic filler, where the component (A) and the component (B) each contains a triphenylmethane skeleton and/or a naphthalene skeleton, and the component (D) contains glycidoxypropyl trialkoxysilane having an alkoxy group having 2 to 4 carbon atoms.SELECTED DRAWING: None
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Inventors:
FUJIEDA SHINETSU
ANDO MOTOTAKE
ANDO MOTOTAKE
Application Number:
JP2018103752A
Publication Date:
November 01, 2018
Filing Date:
May 30, 2018
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C08L63/00; C08G59/06; C08K3/013; C08K5/5435; C08K5/5465; C08K9/06; C08L65/00; C09K3/10
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Attorney, Agent or Firm:
Makoto Kataoka
Toshihide Ishihara
Toshihide Ishihara