PURPOSE: To provide the subject material containing specific epoxy resin, perfluoroalkenylated phenolic resin, cure accelerator and silica powder as inorganic filler, having excellent thermal shock resistance and moisture resistance and capable of improving the reliability of a semiconductor device.
CONSTITUTION: The objective molding material contains (A) an epoxy resin containing ≥2 epoxy groups in one molecule and having an epoxy equivalent of ≤250 [preferably a compound of formula (R is H or 1-10C alkyl)], (B) a perfluoroalkenylated phenolic resin containing perfluoroalkenylated hydroxyl groups as a part of the hydroxyl groups, containing ≥2 unsubstituted hydroxyl groups in one molecule and having a hydroxyl equivalent of ≤250, (D) a cure accelerator (e.g., 2-ethylimidazole) and (D) silica powder (preferably fused silica powder or spherical silica powder) as an inorganic filler.
AZUMA MICHIYA
UCHIDA TAKESHI
FUJIEDA SHINETSU
