PURPOSE: To improve the crack resistance property at moisture absorptive solder treatment by making it contain naphthalene framework epoxy resin, epoxy silicon deformed novolak phenol resin, vinyl silicon, and hydrodiene silicon.
CONSTITUTION: For epoxy resin, epoxy resin which has naphthalene framework having two or more pieces of epoxy groups in one molecule is used, and as epoxy silicon deformed novolak type phenol resin, novolak type phenol resin, which has epoxy groups in one molecule, can be cited. Vinyl silicon has vinyl groups directly coupled with silicon atoms in one molecule, and hydrodiene silicon has two or more pieces of hydrogen atoms directly coupled with silicon atoms in one molecule. These ones are as reactants being reacted in advance. The reaction is performed by heating them for 20-120min at 50-160°C, whereby reactants can be gotten.
KIYOUGAKU MASAYUKI
TORII MUNETOMO
