Title:
EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH02124921
Kind Code:
A
Abstract:
PURPOSE:To obtain the title molding material with excellent humidity resistance useful for a resin sealing of electrical components, etc., by adding a filler finished with a chromium coupling agent in advance in the title molding material formed by adding additives to an epoxy resin. CONSTITUTION:In the title molding material formed by adding, if necessary, additives such as a crosslinking agent, a curing agent, a curing accelerator, a filler, a releasing agent and a coloring material, the filler is added thereto after the surface of the filter (e.g., silica) is finished with pref. 0.01-5 pts.wt. chromium coupling agent (e.g., methacrylate/chromic chloride) based on 100 pts.wt. filler.
Inventors:
ARAI TAKAFUMI
IKOMA SUNAO
IKOMA SUNAO
Application Number:
JP27795688A
Publication Date:
May 14, 1990
Filing Date:
November 02, 1988
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08K9/00; C08G59/00; C08G59/18; C08L63/00; H01C1/02; H01L23/29; H01L23/31; H05K3/28; (IPC1-7): C08G59/18; C08K9/00; C08L63/00; H01C1/02; H01L23/29; H01L23/31; H05K3/28
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)