Title:
EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH03106960
Kind Code:
A
Abstract:
PURPOSE:To prepare an epoxy resin molding material excellent in the crack resistance and moldability and useful for electronic parts by compounding a specific epoxy resin, a compd. having phenolic hydroxyl groups, and a specific copolymer as the essential components. CONSTITUTION:The title material comprises an epoxy resin having two or more epoxy groups in the molecule (e.g. cresol novolac epoxy resin), a compd. having two or more phenolic hydroxy groups in the molecule (e.g. phenol novolac resin), and a copolymer of a thermoplastic resin (e.g. polystyrene) with a polyorganosiloxane.
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Inventors:
HAGIWARA SHINSUKE
AKAGI SEIICHI
ICHIMURA SHIGEKI
AKAGI SEIICHI
ICHIMURA SHIGEKI
Application Number:
JP24413889A
Publication Date:
May 07, 1991
Filing Date:
September 20, 1989
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08G59/00; C08G59/62; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hirose Akira