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Title:
EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS5817146
Kind Code:
A
Abstract:

PURPOSE: To improve the mechanical strength and electrical properties, by adding flaky glass to an epoxy resin molding material.

CONSTITUTION: As a filler, flaky glass is added to an epoxy resin molding material. The blended flaky glass comes in firm surface contact with the epoxy resin due to its planar structure, and the obtained material exhibits excellent mechanical strength that would never be obtained by use of a one-dimensional structural linear filler or powder filler. Owing to the planar structure of the flaky glass, moisture is prevented from entering the molded material, and the electrical properties, particularly a specific volume resistance after absorption of moisture, are improved.


Inventors:
KUNITOMI TETSUO
MATSUMURA MASAHIRO
Application Number:
JP11661781A
Publication Date:
February 01, 1983
Filing Date:
July 24, 1981
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/00; C08K7/00; C08L63/00; H01B3/40; (IPC1-7): C08K7/00; C08L63/00; H01B3/40
Attorney, Agent or Firm:
Takehiko Matsumoto



 
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