Title:
エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
Document Type and Number:
Japanese Patent JP7160058
Kind Code:
B2
Abstract:
An epoxy resin, comprising an epoxy compound having a mesogen structure,wherein, when performing a process of decreasing a temperature of the epoxy resin from 150°C to 30°C at a rate of 2°C/min, and a process of increasing the temperature of the epoxy resin from 30°C to 150°C at a rate of 2°C/min, in this order,the epoxy resin has a maximum value of η'2/η'1 of 20 or less within a temperature range of from 30°C to 150°C, wherein η'1 is a dynamic shear viscosity (Pa·s) measured in the process of decreasing the temperature, and η'2 is a dynamic shear viscosity (Pa·s) measured in the process of increasing the temperature, η'1 and η'2 being measured at the same temperature, and a value of η'2 measured at 100°C is 1000 Pa·-s or less.
Inventors:
Naoki Maruyama
Tomoko Higashiuchi
Kazuma Fukuda
Yuka Yoshida
Takezawa Yutaka
Tomoko Higashiuchi
Kazuma Fukuda
Yuka Yoshida
Takezawa Yutaka
Application Number:
JP2020026634A
Publication Date:
October 25, 2022
Filing Date:
February 19, 2020
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C08G59/02; C08G59/24; C08L63/00
Domestic Patent References:
| JP2013227451A | ||||
| JP2016113540A |
Foreign References:
| WO2016104788A1 | ||||
| WO2018070534A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office