Title:
両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造される室温硬化型ハイソリッドコーティング
Document Type and Number:
Japanese Patent JP2008519884
Kind Code:
A
Abstract:
A curable ambient cure high-solids coating composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units; such that when the epoxy resin composition is cured, the toughness of the resulting cured epoxy resin composition is increased; and (c) a sufficient amount of a nitrogen-containing curing agent to cure the coating composition at ambient temperature of less than about 60° C.
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Inventors:
Wheels, Stephen M.
Burgess, Kandasil Yi.
Burgess, Kandasil Yi.
Application Number:
JP2007541250A
Publication Date:
June 12, 2008
Filing Date:
November 02, 2005
Export Citation:
Assignee:
Dow Global Technologies Incorporated
International Classes:
C09D163/00; C08G59/50; C09D7/12; C09D171/00; C09D171/02; C09D177/00
Domestic Patent References:
| JPH02248423A | 1990-10-04 | |||
| JPH07252345A | 1995-10-03 | |||
| JPH09324110A | 1997-12-16 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Takashi Ishida
Tetsuji Koga