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Title:
EPOXYSILICONE COMPOSITION MODIFIED WITH OXO ACID
Document Type and Number:
Japanese Patent JP3955137
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain an epoxysilicone composition which improves compatibility with a photocatalyst and used in an ultraviolet-curing silicone release coating composition by selecting a silicone containing a reaction product of an epoxysilicone with an oxo acid.
SOLUTION: This composition contains a reaction product of an epoxysilicone selected from among formulas I, II and III (wherein M is (CH3)3SiO1/2, ME is (C6H9O(CH2)2(CH3)2SiO1/2, D is (CH3)2SiO2/2, D' is (((CH3)(CH2)q)((CH3)(CH2)r) SiO2/2 or the like each of which has a viscosity of 100-1000,000cSt at 25°C) and a mixture thereof with an oxo acid represented by the formula: HOOC ((CH2)sO)f((CH2)uO)v)R" (wherein R" is H, a 1-40C alkyl, an alkylene, an alkinylene, an aromatic, an alkylaromatic or carboxyl; and (s), (t), (u) and (v) are each 0 or a positive integer (at least (s) and (t) or (u) and (v) are positive integers)). The photocatalyst used is desirably a diaryl iodonium salt.


Inventors:
Richard Paul Eckberg
Robert Francis Agers
Application Number:
JP31787897A
Publication Date:
August 08, 2007
Filing Date:
November 19, 1997
Export Citation:
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Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C08G77/14; C08F2/50; C08G59/42; C08G77/38; C08G77/46; C09D183/06; C09D183/12; (IPC1-7): C08G77/14; C08G59/42
Domestic Patent References:
JP1297421A
JP4339816A
Attorney, Agent or Firm:
Kenichi Matsumoto
Masayuki Masabayashi