Title:
EQUIPMENT AND METHOD FOR CLEANING UP SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPH08293478
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To set time required for cleaning a semiconductor wafer to be a minimum by changing the position of a semiconductor wafer and one level in liquid in a bath with respect to the semiconductor wafer so that the whole face of the semiconductor wafer passes through the gas-liquid interface and repreating the process plural times. SOLUTION: Liquid is put in the bath 42, the gas-liquid interface is formed on the surface of liquid and the semiconductor wafer W is oriented in the bath 42 in an almost erected state. A part of the semiconductor wafer W is inserted so that it exists below the gas-liquid interface in liquid. A mega-sonic wave converter 40 guides sonic energy to liquid in the both 42. The position of the semiconductor wafer and one level in liquid in the bath 42 with respect to the semiconductor wafer W are changed so that the whole face of the semiconductor wafer W passes through the gas-liquid interface, and the process is repeated plural times. Thus, time required for cleaning the semiconductor wafer W is set to be a minimum.
Inventors:
HENRII EFU AAKU
RONARUDO DEIIN BAATORAMU
YUUJIIN ROBAATO HORANDAA
JIN CHIYAI
RONARUDO DEIIN BAATORAMU
YUUJIIN ROBAATO HORANDAA
JIN CHIYAI
Application Number:
JP9808596A
Publication Date:
November 05, 1996
Filing Date:
April 19, 1996
Export Citation:
Assignee:
MEMC ELECTRONIC MATERIALS
International Classes:
H01L21/304; B08B3/10; B08B3/12; H01L21/00; H01L21/306; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)
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