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Patent Searching and Data


Title:
EQUIPMENT AND METHOD FOR MEASURING THICKNESS OF DIELECTRIC THIN FILM
Document Type and Number:
Japanese Patent JP2002022639
Kind Code:
A
Abstract:

To provide a nondestructive and noncontact equipment and method for measuring the thickness of a dielectric thin film having a thickness of 4.0 nm or less easily with high accuracy.

A constant distance of 0.2 nm or less is set between a dielectric thin film 2 on an electrode 4 and a probe 3 using a piezoelectric element (Z axis) 5 and the interatomic force is set in a repulsive force mode. When a constant voltage source 17 is operated to apply a voltage between the probe 3 and the electrode 4, a tunnel current 15 flows through the dielectric thin film 2. Thickness of the dielectric thin film 2 is measured by measuring the tunnel current by means of an ammeter 16.


Inventors:
KOMORI JUNKO
Application Number:
JP2000207612A
Publication Date:
January 23, 2002
Filing Date:
July 10, 2000
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01N1/28; G01Q30/06; G01Q60/10; G01Q60/16; G01Q60/24; G01Q60/38; H01L41/09; (IPC1-7): G01N13/12; G01N1/28; G01N13/16; G12B21/04; G12B21/08; H01L41/09
Attorney, Agent or Firm:
Kodama Toshihide