To provide equipment and a method for plating a substrate, which can form a plated film on a restricted part on an already plated part of the substrate and can form a uniform metal-plated film.
The equipment for plating a metal for circuit wiring on a substrate 1 comprises, an anodic electrode member 2-2 which is arranged in the opposite side of a surface to be plated 1a of the substrate 1 and has an approximately same area as a desired range to be plated, which is smaller than the surface to be plated 1a of the substrate 1, a porous body member 2-3 which contacts with the anodic electrode member 2-2, a plating liquid supply and exhaust opening 2-6 for introducing the plating liquid into a space 2-7 formed between a surface to be plated 1a of the substrate 1 and the porous body member 2-3, a plating cell 2 provided with a cathode electrode member 2-4 for providing a power supply to the surface to be plated 1a, and a substrate holding part for holding the substrate.
MISHIMA KOJI
KUNISAWA JUNJI
INOUE HIROAKI
MAKINO NATSUKI
MATSUDA TETSURO
KANEKO HISAFUMI
TOSHIBA CORP