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Title:
EQUIPMENT AND METHOD OF POSITIONING WAFER INSIDE EXPOSURE DEVICE
Document Type and Number:
Japanese Patent JP2004327972
Kind Code:
A
Abstract:

To provide equipment for positioning a wafer inside an exposure device.

The equipment comprises a holder 124 constituted to hold a wafer 126 (having a plurality of positioning mark), a rough positioning device, and a fine positioning device having more accuracy than the rough positioning device. The fine positioning device has a plurality of photodetectors 122. Each photodetector is arranged in order to detect a corresponding positioning mark on the wafer. A positioning processor 120 is connected to the plurality of photodetector and holder, and controls them. The plurality of photodetectors are controlled by the positioning processor, and detect the plurality of positioning mark in parallel operation. Further, the positioning processor processes signals from the plurality of photodetector in parallel operation at a time.


Inventors:
WU QIANG
CHEN BOMY A
Application Number:
JP2004104638A
Publication Date:
November 18, 2004
Filing Date:
March 31, 2004
Export Citation:
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Assignee:
IBM
International Classes:
G03F7/20; G01B11/00; G03F9/00; H01L21/027; (IPC1-7): H01L21/027; G03F7/20
Domestic Patent References:
JP2000068192A2000-03-03
JP2003347185A2003-12-05
JP2000228347A2000-08-15
JPH10209029A1998-08-07
JPH11304422A1999-11-05
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno



 
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