Title:
めっき槽にめっき液を供給するための装置および方法、並びにめっきシステム
Document Type and Number:
Japanese Patent JP6767243
Kind Code:
B2
Abstract:
An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
Inventors:
Haruharu
Yoshitaka Mukaiyama
Yuji Araki
Tadashi Shimoyama
Junpei Fujikata
Yoshitaka Mukaiyama
Yuji Araki
Tadashi Shimoyama
Junpei Fujikata
Application Number:
JP2016220952A
Publication Date:
October 14, 2020
Filing Date:
November 11, 2016
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D21/14; C25D17/00
Domestic Patent References:
| JP2010202941A | ||||
| JP6192897A | ||||
| JP60138097A | ||||
| JP2015113186A | ||||
| JP10154871A |
Foreign References:
| US6168305 | ||||
| WO2001068952A1 | ||||
| US20070297877 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa