Title:
機器の取付構造
Document Type and Number:
Japanese Patent JP7418989
Kind Code:
B2
Abstract:
To provide a device mounting structure that can improve the appearance.SOLUTION: A device mounting structure according to an embodiment includes an attached portion and a support portion. The attached portion is arranged at a predetermined installation location and the device A is attached to the attached portion. The support portion is fixed to the attached portion and supports the device. Further, the support portion includes a first wiring hole that is formed on the outer peripheral side of a member having a facing surface facing the attached portion, and through which a wiring of the device is inserted. The attached portion includes a second wiring hole through which the wiring of the device is inserted. Further, the first wiring hole is positioned so as to coincide with at least a part of the outer shape of the second wiring hole.SELECTED DRAWING: Figure 3
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Inventors:
Ryosuke Yamamoto
Application Number:
JP2019139960A
Publication Date:
January 22, 2024
Filing Date:
July 30, 2019
Export Citation:
Assignee:
Densoten Co., Ltd.
International Classes:
H05K5/02; B60R11/02; H04R1/02; H05K7/00
Domestic Patent References:
| JP2011009844A | ||||
| JP2005204211A | ||||
| JP2005318994A | ||||
| JP2000022344A | ||||
| JP1235776A | ||||
| JP2018073879A | ||||
| JP2014210474A | ||||
| JP2020523702A |
Foreign References:
| KR100547776B1 | ||||
| US20080220646 |
Attorney, Agent or Firm:
Sakai International Patent Office