Title:
円板状ワークの同時両面研削のための装置
Document Type and Number:
Japanese Patent JP4012546
Kind Code:
B2
Abstract:
A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.
Inventors:
Joachim Junge
Robert Weiss
Robert Weiss
Application Number:
JP2005067636A
Publication Date:
November 21, 2007
Filing Date:
March 10, 2005
Export Citation:
Assignee:
Siltronic AG
International Classes:
B24B7/17; B24B41/00; B24B41/047; B24B49/00; H01L21/304
Domestic Patent References:
| JP2002307303A | ||||
| JP200162718A | ||||
| JP11320360A | ||||
| JP2003236746A | ||||
| JP2000280155A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel