Title:
両面センサパッケージとして使用される装置
Document Type and Number:
Japanese Patent JP5351943
Kind Code:
B2
Abstract:
A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e.g., wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.
Inventors:
Wojin Kim
Aniela bleizek
Joan Duncaster
Don-Suk Kim
Aniela bleizek
Joan Duncaster
Don-Suk Kim
Application Number:
JP2011195530A
Publication Date:
November 27, 2013
Filing Date:
September 08, 2011
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
G01L19/14; G01D21/02; G01P1/02; G01P15/08; H01L29/84
Domestic Patent References:
| JP10104101A | ||||
| JP2001033337A | ||||
| JP2000329632A | ||||
| JP2010192511A | ||||
| JP2003084008A |
Foreign References:
| WO2005019790A1 | ||||
| US7408254 | ||||
| US7847387 | ||||
| US6051878 | ||||
| US20110260266 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa