PURPOSE: To obtain the subject composition excellent in moisture resistance and soldering heat resistance, little in the affection with absorbed moisture, not generating the breakage of wires due to the corrosion of electrodes, and suitable for sealing semiconductor chips, etc., by modifying a specific epoxy resin and a phenol resin as a curing agent with a specified polyimide resin.

CONSTITUTION: This composition comprises (A) an epoxy resin of formula I [R1 is CjH2j+1; R2 is CkH2k+1; R3 is ClH21+1; R4 is CmH2m+1 (j), (k), (l), (m), (n) is 0 or an integer of ≥1)], (B) a phenol resin, (C) a polyimide resin of formula II (R5 is ClH21+1; R6 is CmH2m+1) and (D) an inorganic filler as essential components, the content of the component D being 25-95wt.% based on the resin composition.