Title:
基板に3次元構造処理を行う装置
Document Type and Number:
Japanese Patent JP2005509544
Kind Code:
A
Abstract:
A device and a method for processing a substrate, wherein a flexible force absorbing means is provide in at least a part of a tool plan and/or a reaction plan, so as to locally absorbing the forces applied by the planes. The flexible force absorbing mean having spring-like properties such that it is adapted to be elastically deformed when the tool plan and the reaction plan are pressed against each other.
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Inventors:
Jesper Tizemann
Esa's Subosevic
Esa's Subosevic
Application Number:
JP2003545460A
Publication Date:
April 14, 2005
Filing Date:
November 22, 2002
Export Citation:
Assignee:
GLUD & MARSTRAND A/S
International Classes:
B81C99/00; B29C59/00; B29C59/04; B44B5/00; B44B5/02; B29C59/02; B29L7/00; B29L31/34; (IPC1-7): B29C59/04; B81C5/00
Attorney, Agent or Firm:
Osamu Kawamiya
Masahiro Ishino
Masahiro Ishino