Title:
EQUIPOTENTIAL BONDING METAL FITTING
Document Type and Number:
Japanese Patent JP2011155769
Kind Code:
A
Abstract:
To provide an equipotential bonding metal fitting which can be assembled to a reinforcing rod by absorbing a little difference in a diameter of the reinforcing rod thereby having versatility and being easy to use.
The equipotential bonding metal fitting is composed of a pair of metallic plate-shaped catching plates 1 and 2, which catch reinforcing rods m engaged with engaging grooves 6 and 16 and fasten them with bolts 3 and 3' and nuts 4 and 4' thereby attaching them to the reinforcing rods m. Then, one catching plate 1 is provided with a through-hole 12 for a bolt 11 for connection of the crimp terminal 10a of a lead wire 10.
More Like This:
| JP2005204447 | LIGHTNING-RECEIVING UNIT FOR CORNER |
Inventors:
WATANABE TOSHIHIRO
ISHII KAZUNORI
SUZUKI HIROYUKI
EZAWA MASAKI
ISHII KAZUNORI
SUZUKI HIROYUKI
EZAWA MASAKI
Application Number:
JP2010015585A
Publication Date:
August 11, 2011
Filing Date:
January 27, 2010
Export Citation:
Assignee:
YURTEC CORP
IWABUCHI CORP
IWABUCHI CORP
International Classes:
H02G13/00; E04B1/92; E04H9/14
Domestic Patent References:
| JP2005032482A | 2005-02-03 | |||
| JPH0454151U | 1992-05-08 |
Attorney, Agent or Firm:
Go Eto
Shigeo Nakajima
Shigeo Nakajima
Previous Patent: DC MOTOR AND ELECTRIC POWER STEERING DEVICE
Next Patent: EQUIPOTENTIAL BONDING METAL FITTING
Next Patent: EQUIPOTENTIAL BONDING METAL FITTING