Title:
エステル化合物、樹脂組成物、硬化物、及び、ビルドアップフィルム
Document Type and Number:
Japanese Patent JP7319969
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an ester compound that can be used in a resin composition that has excellent heat resistance and dielectric properties after curing. Additionally, the purpose of the present invention is to provide: a resin composition containing the ester compound; a cured product of the resin composition; and a build-up film that is produced using the resin composition. The present invention is an ester compound having a phenylene ether oligomer structure in the main chain thereof, and having a polycyclic aromatic carbonyloxy group at both ends thereof.
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Inventors:
Shindo sincerity
Kohei Takeda
Tatsufumi Hayashi
Yuko Kawahara
Akiko Kubo
Kohei Takeda
Tatsufumi Hayashi
Yuko Kawahara
Akiko Kubo
Application Number:
JP2020515267A
Publication Date:
August 02, 2023
Filing Date:
February 06, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08G65/48; B32B27/38; C07C69/773; C08G59/40; C08G65/38; H05K1/03; H05K3/46
Domestic Patent References:
| JP2018508603A | ||||
| JP2010503754A | ||||
| JP2004149698A |
Foreign References:
| CN108164684A |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus