Title:
ETCHANT COMPOSITION, AND ETCHING METHOD
Document Type and Number:
Japanese Patent JP2014189834
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an etchant composition with which, when collectively etching a laminate film consisting of an indium oxide-based coating film and a metal-based coating film, a reduction in a width of a formed fine line consisting of the indium oxide-based coating film and the metal-based coating film is small and mouse bites of the fine line are not caused.SOLUTION: An etchant composition for collectively etching a laminate layer consisting of an indium oxide-based coating film and a metal-based coating film consists of an aqueous solution containing (A) at least one or more kinds of oxidant components selected from ferric ion and cupric ion, (B) hydrochloric acid component, (C) at least one or more kinds of compound components selected from a group of compounds represented by following general formula (1) and straight or branched alcohols having 1 to 4 carbon atoms, and (D) at least one or more kinds of acid components selected from sulfuric acids or phosphoric acids. In the general formula (1), Rand Rare each independently hydrogen, or a straight or branched alkyl group having 1 to 4 carbon atoms, Ris a straight or branched alkylene group having 1 to 4 carbon atoms, and n is the number of 1 to 3.
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Inventors:
MASAMOTO YUJI
KISHI YUICHIRO
KISHI YUICHIRO
Application Number:
JP2013066282A
Publication Date:
October 06, 2014
Filing Date:
March 27, 2013
Export Citation:
Assignee:
ADEKA CORP
International Classes:
C23F1/16
Domestic Patent References:
| JP2009167459A | 2009-07-30 | |||
| JP2009235438A | 2009-10-15 | |||
| JP2005330572A | 2005-12-02 |
Attorney, Agent or Firm:
Michiharu Soga
Jun Kajinami
Kazuhiro Oya
Tomohito Iino
Jun Kajinami
Kazuhiro Oya
Tomohito Iino