Title:
ETCHANT COMPOSITION AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP3962239
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an etchant composition with which etching of an electrolytic plating layer consisting of a copper-containing material is little even when a power feed film consisting of the copper-containing material is sufficiently etched and a pattern forming method.
SOLUTION: The etchant composition consists of an aqueous solution essentially consisting of bivalent iron ions, hydrochloric acid, a copper-containing material etching suppressor and a copper-containing material etching accelerator. The pattern forming method comprises a first process step of forming the power feed film mainly composed of the layer consisting of the copper-containing material by an electroless plating method for electrolytic plating on a substrate, a second process step of forming resist patterns on the power feed layer, a third process step of forming the electrolytic plating layer consisting of the copper-containing material by the electrolytic plating method in the apertures of the resist patterns, a fourth process step of removing the resist patterns, and a fifth process step of removing the unnecessary segments of the power feed film by etching using the above etchant composition.
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Inventors:
Kimihiko Ikeda
Application Number:
JP2001332781A
Publication Date:
August 22, 2007
Filing Date:
October 30, 2001
Export Citation:
Assignee:
ADEKA CORPORATION
International Classes:
C23F1/18; C25D7/00; C23C28/00; H05K3/06; H05K3/18; (IPC1-7): C23F1/18; C23C28/00; C25D7/00; H05K3/06; H05K3/18
Domestic Patent References:
| JP6057452A | ||||
| JP2000104183A | ||||
| JP2000286531A |
Attorney, Agent or Firm:
Michiteru Soga
Michiharu Soga
Yutaka Ikeya
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Michiharu Soga
Yutaka Ikeya
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order