Title:
ETCHANT FOR COPPER OR COPPER ALLOY
Document Type and Number:
Japanese Patent JP2018184624
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an etchant which etches copper or a copper alloy and whose copper etching rate does not decrease.SOLUTION: The etchant contains an organic phosphonic acid (A) and hydrogen peroxide (B) and has a chlorine ion concentration of 10 ppm or less. Preferably, the etchant also contains an amine compound (C), and the organic phosphonic acid (A) is a diphosphonic acid and/or a triphosphonic acid. A method of manufacturing an electronic substrate is used which includes a step of etching copper or a copper alloy from an electronic substrate having the copper or the copper alloy by using the etchant for copper or a copper alloy.SELECTED DRAWING: None
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Inventors:
KOJIMA TOSHIKI
SATO SHOHEI
SATO SHOHEI
Application Number:
JP2017085671A
Publication Date:
November 22, 2018
Filing Date:
April 24, 2017
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C23F1/18; H01L21/308
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