Title:
ETCHANT FOR CURED EPOXY RESIN
Document Type and Number:
Japanese Patent JP3286115
Kind Code:
B2
Abstract:
PURPOSE: To enable the removal of an unmodified epoxy resin without using concentrated sulfuric acid, chromic acid, etc., by using an alcohol solvent and water to adjust the composition of an etchant for a specific cured epoxy resin.
CONSTITUTION: A bifunctional epoxy resin is mixed with a halogenated dihydric phenol such as a halogenated (alkylated) dihydric phenol in such a ratio that the proportion of the epoxy groups to the phenolic hydroxyl groups is 1/0.9 to 1/1.1. This mixture is thermally polymerized in an amide or ketone solvent having a b.p. of 130°C or higher in the presence of an etherification catalyst to obtain an epoxy resin (A) having a mol.wt. of 100,000 or higher and capable of forming a film. The ingredient (A) is compounded with a crosslinking agent (B) consisting of a masked isocyanate and a polyfunctional epoxy resin, an amide solvent (C), an alcohol solvent solution (D) of 0.5-40wt.% alkali metal compound and water (E). The amounts of the ingredients (B), (C), (D), and (E) are 20-100wt.%, 30-89%, 1-60wt.%, and 10-30wt.%, respectively, based on the ingredient (A).
Inventors:
Nobuyuki Ogawa
Hiroshi Shimizu
Katsuji Shibata
Shoshi Nakaso
Hiroshi Shimizu
Katsuji Shibata
Shoshi Nakaso
Application Number:
JP13508995A
Publication Date:
May 27, 2002
Filing Date:
June 01, 1995
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08J7/00; C08G59/20; C08J7/02; C08L63/00; C09D9/00; C09K13/06; H05K3/00; H05K3/46; H05K1/00; (IPC1-7): C08G59/20; C08J7/02
Domestic Patent References:
| JP517604A | ||||
| JP4826855A | ||||
| JP4826856A | ||||
| JP5170267A | ||||
| JP55144032A | ||||
| JP333124A | ||||
| JP420539A | ||||
| JP4339853A | ||||
| JP59316A | ||||
| JP5209111A | ||||
| JP8330740A | ||||
| JP8330741A | ||||
| JP8330742A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)