ETCHANT FOR CURED EPOXY RESIN

Japanese Patent JP3286117

B2

PURPOSE: To enable the removal of an unmodified epoxy resin without using concentrated sulfuric acid, chromic acid, etc., by using an amide solvent and an alcohol solution of an alkali metal compound to form an etchant for a specific cured epoxy resin.
CONSTITUTION: A bifunctional epoxy resin is mixed with a halogenated dihydric phenol in such a ratio that the amount of the phenolic hydroxyl groups is 0.9 to 1.1 equivalent based on the epoxy groups. This mixture is thermally polymerized at 60-150°C in an amide or ketone solvent having a b.p. of 130°C or higher at a reactant solid concentration of 50wt.% or lower in the presence of a catalyst to obtain a film-forming epoxy polymer (A) having a mol.wt. of 100,000 or higher. The ingredient (A) is compounded with a masked isocyanate and a polyfunctional epoxy resin as crosslinking agents, a curing agent, a curing accelerator, a silane coupling agent, an amide solvent, and an alcohol solution of an alkali metal compound. The amount of the isocyanate groups of the masked isocyanate is 0.1-1.0 equivalent based on the hydroxyl groups of the ingredient (A), and that of the polyfunctional epoxy resin is 20-100wt.% based on the ingredient (A).

Nobuyuki Ogawa
Hiroshi Shimizu
Katsuji Shibata
Shoshi Nakaso

JP13509195A

May 27, 2002

June 01, 1995

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Hitachi Chemical Co., Ltd.

C08J7/00; C08G59/20; C08G59/30; C08J7/02; C08L63/00; C09K13/06; H05K3/00; H05K3/46; H05K1/00; (IPC1-7): C08G59/20; C08J7/02

JP517604A
JP4826855A
JP4826856A
JP5170267A
JP55144032A
JP333124A
JP420539A
JP4339853A
JP59316A
JP5209111A
JP8330740A
JP8330741A
JP8330742A

Hidekazu Miyoshi (1 outside)

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