Title:
ETCHING ACCURACY EVALUATING METHOD AND TESTING SUBSTRATE THEREFOR
Document Type and Number:
Japanese Patent JP2002069671
Kind Code:
A
Abstract:
To accurately evaluate an etching accuracy against all over a substrate in a short time.
This method for evaluating the etching accuracy comprises forming a test pattern 2 for measuring resistance including test patterns 21-24 each with a predetermined width and a space between lines arranged in rows and columns on all over the test substrate, measuring a resistance value after etching, and assuming a finished state of a circuit pattern by converting the resistance value into the widths of the line.
Inventors:
MATSUOKA HIDEKI
Application Number:
JP2000263182A
Publication Date:
March 08, 2002
Filing Date:
August 31, 2000
Export Citation:
Assignee:
ELNA CO LTD
International Classes:
C23F1/00; C23F1/18; H05K3/06; (IPC1-7): C23F1/00; C23F1/18; H05K3/06
Domestic Patent References:
| JPH09162522A | 1997-06-20 | |||
| JPH10145029A | 1998-05-29 |
Attorney, Agent or Firm:
Takuya Ohara