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Title:
ETCHING AGENT
Document Type and Number:
Japanese Patent JP2013167024
Kind Code:
A
Abstract:

To provide an etching agent which can prevent the dimensional accuracy of a wiring pattern from being lowered when an electroless-plated layer of copper is removed in a semi-additive process.

A first etching agent is a copper etching agent containing sulfuric acid, hydrogen peroxide and water, and further containing a benzotriazole derivative that includes two or more of at least one of a carboxy group and a hydroxy group in its molecule. A second etching agent is a copper etching agent containing sulfuric acid, hydrogen peroxide and water, and further containing azoles having only a nitrogen atom as a heteroatom existing in its ring, and a polybasic acid having two or more of carboxy groups or a salt thereof.


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Inventors:
NAKAMURA MASAMI
YOSHIUMI MASASHI
AKIYAMA DAISAKU
Application Number:
JP2013077646A
Publication Date:
August 29, 2013
Filing Date:
April 03, 2013
Export Citation:
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Assignee:
MEC KK
International Classes:
C23F1/18; H05K3/06; H05K3/18
Domestic Patent References:
JPH11140669A1999-05-25
JPH0657454A1994-03-01
JP2006210492A2006-08-10
JP2006013340A2006-01-12
JP2004190054A2004-07-08
JP2003338676A2003-11-28
JP2002060980A2002-02-28
JPH11140669A1999-05-25
JPH0657454A1994-03-01
JP2006210492A2006-08-10
JP2006013340A2006-01-12
JP2004190054A2004-07-08
JP2003338676A2003-11-28
JP2002060980A2002-02-28
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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