Title:
ETCHING APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE THEREOF
Document Type and Number:
Japanese Patent JP3594583
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dry etching apparatus which can restrict differences in CD shifts of a substrate during operation, and a method for controlling the temperature thereof.
SOLUTION: This etching apparatus includes a treatment device disposed in a reaction chamber, in which etching treatment is performed, and provided with an electrode internally packaging a refrigerant circulation passage, a cooling device, which circulates a refrigerant in the refrigerant circulation passage at predetermined temperature and flow rate and cools the refrigerant, and a control device for controlling the temperature or the flow rate of the refrigerant. The method for controlling temperature of this etching apparatus comprises steps of monitoring operation conditions in the reaction chamber, and controlling the temperature of the electrode by controlling the temperature or the flow rate of the refrigerant, based on the information about the operation conditions.
Inventors:
Hideki Harano
Yuji Seo
Yuji Seo
Application Number:
JP2002003440A
Publication Date:
December 02, 2004
Filing Date:
January 10, 2002
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
F25B25/00; H01L21/302; F25D17/02; H01L21/3065; (IPC1-7): H01L21/3065; F25D17/02
Domestic Patent References:
| JP2001093883A | ||||
| JP10223499A | ||||
| JP9172001A |
Attorney, Agent or Firm:
Kato Asamichi