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Title:
エッチング装置
Document Type and Number:
Japanese Patent JP5382125
Kind Code:
B2
Abstract:
An etching equipment including a stage, a plasma generator, a center electrode, and a peripheral electrode is provided. The work-piece is mounted on the mounting surface of the stage. The plasma generator generates plasma above the stage, wherein the plasma generator generates plasma at a higher concentration around a center axis of the mounting surface than on the center axis. The center electrode is disposed at a lower side of a space in which the plasma generator generates plasma and at a position through which the center axis passes. The center electrode is configured capable of controlling a potential of the center electrode. The peripheral electrode is disposed at an upper side of the stage and a lower side of the center electrode, wherein the peripheral electrode extends along a periphery of the center electrode. The peripheral electrode is configured capable of controlling a potential of the peripheral electrode.

Inventors:
Kamijo Takuma
Application Number:
JP2011529796A
Publication Date:
January 08, 2014
Filing Date:
July 21, 2010
Export Citation:
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Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
JPS5676242A1981-06-23
JPH06252097A1994-09-09
JPH01238120A1989-09-22
Attorney, Agent or Firm:
Kaiyu International Patent Office



 
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