Title:
ETCHING DEVICE
Document Type and Number:
Japanese Patent JPS58166736
Kind Code:
A
Abstract:
PURPOSE:To obtain the etching device, which can etch materials to be etched properly and has high productivity, by providing a measuring mechanism measuring the thickness of etching of each material to be etched before etching and a handler mechanism immersing a cartridge into an etching tank for a fixed time on the basis of informations by the measuring mechanism. CONSTITUTION:Only a wafer 2 in a variance region of film thickness in an extent that insufficient etching and excessive one are not generated is controlled by a control system on the basis of informations in case of measurement, and the cartridge lifting mechanism of a wafer feeding section 1 is operated while the wafer 2 is forwarded by a pusher 12. A handler 27 is operated and turned over, the cartridge 4 of a feed section 5 for etching, an inserting detaching port thereof is directed upward, is clamped by a clamper 26, and carried, the cartridge 4 is immersed into an etching liquid 29 in the etching tank 6 for a fixed time, and the aluminum films of the surfaces of each wafer 2 are etched. Etching time at that time is set automatically on the basis of informations in case of measurement of the measuring mechanism 3.
Inventors:
SUMITOMO KENJI
YOSHIDA KIYOSHI
YOSHIDA KIYOSHI
Application Number:
JP4913882A
Publication Date:
October 01, 1983
Filing Date:
March 29, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/677; H01L21/00; H01L21/306; (IPC1-7): H01L21/306
Attorney, Agent or Firm:
Toshiyuki Usuda