Title:
ETCHING LIQUID COMPOSITION FOR SILVER-CONTAINING MATERIAL AND ETCHING METHOD
Document Type and Number:
Japanese Patent JP2017171992
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an etching liquid composition for silver-containing material capable of etching a silver-containing material at higher speed while suppressing generation of residues mainly containing silver chloride in spite of containing hydrogen chloride and capable of forming fine lines less in thinning of the film body.SOLUTION: There is provided an etching liquid composition for silver-containing material containing (A) nitric acid of 0.1 to 10 mass%, (B) sulfuric acid of 0.1 to 20 mass%, (C) hydrogen chloride of 13 to 30 mass% and water and having specific gravity of 1.10 to 1.15 and pH of less than 1.SELECTED DRAWING: None
Inventors:
SAIBI YOSHIHIDE
SASAKI ASAKO
MASAMOTO YUJI
SASAKI ASAKO
MASAMOTO YUJI
Application Number:
JP2016059471A
Publication Date:
September 28, 2017
Filing Date:
March 24, 2016
Export Citation:
Assignee:
ADEKA CORP
International Classes:
C23F1/30; C09K13/04; H01L21/308
Attorney, Agent or Firm:
Toshieko Kondo
Chongqing Sugano
Kaoru Okada
Keita Takeyama
Chongqing Sugano
Kaoru Okada
Keita Takeyama