Title:
ETCHING LIQUID FOR COPPER OXIDE
Document Type and Number:
Japanese Patent JP2016134436
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an etching liquid for copper oxide suitable for uniform fine patterning.SOLUTION: An etching liquid for copper oxide contains water, and a component for dissolving copper oxide, and the iron ion concentration of which is 1000 ppm or less. When the etching liquid is made to act on a copper oxide-containing layer, where exposed portions mainly composed of copper oxide (I), and unexposed portions mainly composed of copper oxide (II) exist mixedly, the copper oxide-containing layer has no residue, and uniform fine patterning is formed.SELECTED DRAWING: None
Inventors:
SHIBA HIROAKI
MITAMURA TETSUTOSHI
MITAMURA TETSUTOSHI
Application Number:
JP2015006884A
Publication Date:
July 25, 2016
Filing Date:
January 16, 2015
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
H01L21/308; C09K13/00; C09K13/06; H01L21/306; H01L21/3065
Domestic Patent References:
| JP2011016975A | 2011-01-27 | |||
| JP2012001757A | 2012-01-05 | |||
| JP2005340649A | 2005-12-08 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Masayoshi Miwa
Amada Masayuki
Masayoshi Miwa
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