Title:
熱可塑性ポリイミド樹脂とポリイミド樹脂の積層体のエッチング方法
Document Type and Number:
Japanese Patent JP7341880
Kind Code:
B2
Abstract:
To provide an etching method with which both a thermoplastic polyimide resin and a polyimide resin can be etched, which brings about no large deviation between an end part of the thermoplastic polyimide resin and that of the polyimide resin after etching, with which an excellent etching shape can be obtained, and with which etching of the thermoplastic polyimide resin can also be completed.SOLUTION: In an etching method to etch a laminate of a thermoplastic polyimide resin and a polyimide resin, the etching method is characterized as including an etching step using an etchant and a water washing step in this order, the etchant contains 25-45 mass% of an alkali metal hydroxide as a first ingredient and 10-40 mass% of an ethanolamine compound as a second ingredient, and a temperature of a washing solution in the water washing step is 70°C or more.SELECTED DRAWING: None
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Inventors:
Hirohiko Goga
Masahiro Tanabe
Takashi Miyazaki
Yuji Toyoda
Masahiro Tanabe
Takashi Miyazaki
Yuji Toyoda
Application Number:
JP2019233442A
Publication Date:
September 11, 2023
Filing Date:
December 24, 2019
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
H01L21/308; C09K13/02
Domestic Patent References:
| JP2002299792A | ||||
| JP2003191412A | ||||
| JP2003082135A | ||||
| JP10097081A |
Foreign References:
| WO2007060824A1 |