Title:
熱可塑性ポリイミド樹脂とポリイミド樹脂の積層体のエッチング方法
Document Type and Number:
Japanese Patent JP7377115
Kind Code:
B2
Abstract:
To provide an etching method that can etch both thermoplastic polyimide resin and polyimide resin, and obtain an excellent etching shape having no large etching deviation between an end of a thermoplastic polyimide resin layer and an end of a polyimide resin layer after the etching.SOLUTION: An etching method of etching a laminate of thermoplastic polyimide resin and polyimide resin includes an etching process using an etchant and a washing process repeatedly twice or more in this order. The laminate of thermoplastic polyimide resin and polyimide resin is a laminate composed of thermoplastic polyimide resin layer/polyimide resin layer/thermoplastic polyimide resin layer and contains in which the etchant contains 25-45 mass% of alkali metal hydroxide as a first component and 10-40 mass% of an ethanolamine compound as a second component, and washing liquid in the washing process has a temperature of 70°C or higher.SELECTED DRAWING: Figure 1
Inventors:
Hirohiko Goga
Masahiro Tanabe
Takashi Miyazaki
Yuji Toyoda
Masahiro Tanabe
Takashi Miyazaki
Yuji Toyoda
Application Number:
JP2020014264A
Publication Date:
November 09, 2023
Filing Date:
January 31, 2020
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
H01L21/308; C09K13/02
Domestic Patent References:
| JP2004039057A | ||||
| JP2008160073A | ||||
| JP2013247348A | ||||
| JP2009277753A |
Foreign References:
| WO2018230377A1 | ||||
| WO2007060824A1 |