Title:
ETCHING OF POLYMETHYL METHACRYLATE
Document Type and Number:
Japanese Patent JPS5865432
Kind Code:
A
Abstract:
A method is described for forming a desired pattern in a layer of polymethyl methacrylate resist formed on a substrate by irradiating the layer with a pattern of radiation substantially identical to the desired pattern and thereafter immersing the layer of polymethyl methacrylate in a solution of acetone to remove the irradiated portion of the layer of polymethyl methacrylate.
Inventors:
POORU ANDORIYUU FURANKU
BURUUSU FUREDERITSUKU GURITSUF
BURUUSU FUREDERITSUKU GURITSUF
Application Number:
JP14350382A
Publication Date:
April 19, 1983
Filing Date:
August 20, 1982
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
G03F7/26; G03F7/039; G03F7/32; H01L21/027; H01L21/30; (IPC1-7): G03C1/00; G03C5/00; G03F7/00; H01L21/30
Domestic Patent References:
| JPS556341A | 1980-01-17 | |||
| JPS5588051A | 1980-07-03 | |||
| JPS52100234A | 1977-08-23 |
Attorney, Agent or Firm:
Tokunji Ikunuma