Title:
フッ化水素酸を含むエッチング溶液
Document Type and Number:
Japanese Patent JP4837211
Kind Code:
B2
Abstract:
This invention relates to etching solutions which comprise hydrofluoric acid and organic solvents for use in the process for the production of integrated circuits. The etching solutions according to the invention are particularly suitable for the selective etching of doped silicate layers.
Inventors:
Zelinsky, Claudia
Rhine, Rudolph
Tempel, Eberhard
Rhine, Rudolph
Tempel, Eberhard
Application Number:
JP2001514467A
Publication Date:
December 14, 2011
Filing Date:
July 05, 2000
Export Citation:
Assignee:
BASF Actien Gezel Shaft
International Classes:
C09K13/08; H01L21/308; H01L21/311
Domestic Patent References:
| JP2000281383A | 2000-10-10 | |||
| JPS5530826A | 1980-03-04 | |||
| JP2000164586A | 2000-06-16 |
Attorney, Agent or Firm:
Kiyoji Kuzuwa