Title:
酸化銅用エッチング液及びそれを用いたエッチング方法
Document Type and Number:
Japanese Patent JP5710585
Kind Code:
B2
Abstract:
In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.
Inventors:
Yoshikiyo Nakagawa
Nakata Takuto
Satoshi Mitamura
Nakata Takuto
Satoshi Mitamura
Application Number:
JP2012501699A
Publication Date:
April 30, 2015
Filing Date:
January 14, 2011
Export Citation:
Assignee:
Asahi Kasei E-materials Co., Ltd.
International Classes:
C09K13/00; G03F7/004; G03F7/32
Domestic Patent References:
| JP2004071673A | 2004-03-04 | |||
| JP2006196744A | 2006-07-27 | |||
| JPH0918143A | 1997-01-17 | |||
| JP2009277905A | 2009-11-26 | |||
| JP2008532289A | 2008-08-14 | |||
| JP2007509235A | 2007-04-12 | |||
| JP2011144377A | 2011-07-28 | |||
| JPH0918143A | 1997-01-17 | |||
| JP2009277905A | 2009-11-26 | |||
| JP2008532289A | 2008-08-14 | |||
| JP2007509235A | 2007-04-12 | |||
| JP2011144377A | 2011-07-28 | |||
| JP2004071673A | 2004-03-04 | |||
| JP2006196744A | 2006-07-27 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki
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