Title:
ETHYLENIC RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JP2007112894
Kind Code:
A
Abstract:
To provide an ethylenic resin composition having excellent folding resistance, flexibility and fluidity.
The ethylenic resin composition is composed of the following components (a), (b), (c) and (d). The content of the component (a) is 5-39 wt.%; the content of the component (b) is 1-20 wt.% and the content of the component (c) is 60-90 wt.% when the sum total of the components (a), (b), (c) and (d) is 100 wt.%. The content of the component (d) is 0.2-3 pts.wt. based on 100 pts.wt. of the sum total of the components (a), (b), (c) and (d). The components are as follows. (a) an ethylenic resin, (b) a tackifier resin and/or an oil, (c) an inorganic filler and (d) a metal salt of an 8-20C fatty acid.
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Inventors:
Kobayashi, Juichi
Application Number:
JP2005000305422
Publication Date:
May 10, 2007
Filing Date:
October 20, 2005
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO LTD
International Classes:
C08L23/04; C08K3/22; C08K3/26; C08K5/098; C08L101/00; H01B7/02; H01B7/295
