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Title:
エチニル誘導体コンポジット、それを含んでなる組成物、それによる塗膜の製造方法、およびその塗膜を含んでなる素子の製造方法
Document Type and Number:
Japanese Patent JP7145217
Kind Code:
B2
Abstract:
[Problem to be Solved] An object is to provide a compound with good heat resistance. And another object is to provide a coating made exhibits less film shrinkage, good gap filling property and good planarization. [Solution] The present invention provides an ethynyl derived composite and a composition comprising thereof. And the present invention provides a method for manufacturing a coating by it, and a method for manufacturing a device.

Inventors:
Shigemasa Nakasugi
Yusuke Hama
Hiroshi Yanagita
Takashi Kudo
Yuriko Matsuura
Application Number:
JP2020529570A
Publication Date:
September 30, 2022
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
Merck Patent Gesellschaft mit beschraenkter Haftung
International Classes:
C08G61/10; C08L65/00; G03F7/11; G03F7/20; G03F7/26
Domestic Patent References:
JP2017021337A
JP2016206676A
JP2016167047A
JP2017125890A
JP2017119671A
Foreign References:
WO2015194273A1
Attorney, Agent or Firm:
Nakamura Yukitaka
Satoru Asakura
Maekawa Hideaki
Itsuko Endo