Title:
EVALUATION METHOD OF SLURRY FOR WIRE SAW SLICING
Document Type and Number:
Japanese Patent JP2000310630
Kind Code:
A
Abstract:
To preliminarily grasp a change in the physical properties of a slurry at a time of slicing without actually performing troublesome and expensive slicing.
Impalpable powder-like silicon is added to an evaluating slurry and the physical properties of the slurry are measured while the slurry is circulated and fluidized by a small-sized impeller pump 20. As the slurry 11, an oily or aq. one may be used and, pref., impalpable powder-like silicon with a particle size of 0.05-50 μm is added.
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Inventors:
OISHI HIROSHI
ASAKAWA KEIICHIRO
MATSUZAKI JUNICHI
ASHIDA AKIO
ASAKAWA KEIICHIRO
MATSUZAKI JUNICHI
ASHIDA AKIO
Application Number:
JP11869799A
Publication Date:
November 07, 2000
Filing Date:
April 26, 1999
Export Citation:
Assignee:
SUPER SILICON KENKYUSHO KK
OTOMO KAGAKU SANGYO KK
OTOMO KAGAKU SANGYO KK
International Classes:
B24B57/02; B28D1/02; B28D5/04; G01N1/36; G01N33/00; (IPC1-7): G01N33/00; B24B57/02; B28D5/04
Attorney, Agent or Firm:
Wataru Ogura