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Patent Searching and Data


Title:
EXAMINING DEVICE FOR GLUE ADHESION FAILURE
Document Type and Number:
Japanese Patent JP2003002308
Kind Code:
A
Abstract:

To provide an examining device for a glue adhesion failure, which dispenses with a trigger sensor requiring an adjusting work highly difficult even for an experienced operator.

The examining device for the glue adhesion failure, which is used for examining whether a glue is properly adhered to a spot for glue adhesion on an article or not, and has a glue detecting means and a process means. The glue detecting means outputs a glue detection signal upon detecting glue adhered to an article on transfer, and the process means determines, basing on the glue detection signal, that the glue has been properly adhered upon detecting the glue again within a determining section after the article has been transferred through a prescribed section starting from a point where the glue is detected first.


Inventors:
Shima, Yukinobu
Application Number:
JP2001000189014
Publication Date:
January 08, 2003
Filing Date:
June 22, 2001
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B65B57/00; B05C11/00; B31B1/62; B31B19/62; B65B57/00; B05C11/00; B31B1/60; B31B19/00; (IPC1-7): B65B57/00; B05C11/00; B31B1/62; B31B19/62