Title:
EXCHANGE METHOD FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPH05251516
Kind Code:
A
Abstract:
PURPOSE: To easily exchange a facedown bonded resin-sealed semiconductor chip, without lowering reliability. CONSTITUTION: A facedown bonded semiconductor chip 4, which is sealed with resin 14, is cut by a cutting end mill and removed from a substrate 2. Then the resin 14 and a bump electrode 16 left on the substrate 2 are ground by a finishing end mill to nearly a half as large as the original height and are thus flattened. Another chip 4A with a bump electrode 6A is positioned at a bump electrode 6 on the substrate 2 and bonded facedown. Lastly, resin 14A is supplied to the gap between the chip 4A and substrate 2 and the circumference of the chip 4A to be sealed.
Inventors:
TSUKADA YUTAKA
Application Number:
JP34482291A
Publication Date:
September 28, 1993
Filing Date:
December 26, 1991
Export Citation:
Assignee:
IBM
International Classes:
H01L21/56; H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)