PURPOSE: To reduce the working time by installing a thin film pulling-up member and an apparatus for spraying fluid between a thin film and an insulative substrate onto a transparent resin film exfoliating apparatus used in the manufacturing process for a printed circuitboard and exfoliating the thin film from the substrate in a moment.

CONSTITUTION: When the top edge of a substrate 1 for printed circuitboard contacts, a thin-film pulling-up member 4 pulls up a part of a transparent resin film 1D. The thin film pulling-up member 4 has a brush on the outer peripheral part of a rotary body. A fluid spraying apparatus 5 sprays the pressurized fluid from a nozzle. The fluid is directly sprayed between the film 1D of the substrate 1 transported by a transport control roller 3 and a photosensitive resin layer 1C. Therefore, when the film 1D is pulled up by the pulling-up member 4, and the liquid is sprayed therebetween, an exfoliated thin-film guide member 6B exfoliates the film 1D in the direction of exfoliation within a range of obtuse angle to nearly right angle for the substrate 1. Then, the film 1D is discharged by a thin-film discharging device 6.