Title:
拡張可能な医療用インプラント
Document Type and Number:
Japanese Patent JP5767764
Kind Code:
B2
Abstract:
An implant includes at least one supporting arrangement which is suited for supporting the implant at or on an implantation position, wherein both the supporting arrangement and the implant are expandable from a first diameter to a second diameter and/or are collapsible from the second diameter to the first diameter. The supporting arrangement includes bars which are connected to each other by means of connecting sections and at least one post for connecting the supporting arrangement with at least one other structure of the implant. At least two of the connecting sections differ in at least one material characteristic, for example, thickness.
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Inventors:
Getz, Wolfgang
Rim, hou-sen
Rim, hou-sen
Application Number:
JP2012553218A
Publication Date:
August 19, 2015
Filing Date:
February 16, 2011
Export Citation:
Assignee:
TRANSCATHETER TECHNOLOGIES GMBH
International Classes:
A61F2/24; A61F2/91; A61F2/915
Domestic Patent References:
| JP2009039581A | ||||
| JP2002102358A | ||||
| JP2005503881A | ||||
| JP2002505146A | ||||
| JP2010501274A | ||||
| JP2010512184A | ||||
| JP2011512920A |
Foreign References:
| US20040034402 |
Attorney, Agent or Firm:
Johei Nakamura
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